Hsinchu – September 11, 2026 -- Spirox Corporation (TWSE: 3055) unveiled its SP7000G high-speed TGV crack inspection system, a tool designed to support mass production testing of glass substrates for next-generation AI and HPC packaging.

Hsinchu – September 11, 2026 -- Spirox Corporation (TWSE: 3055) has launched the SP7000G, a high-speed crack inspection system designed to support high-volume manufacturing of through-glass-via (TGV) substrates for next-generation AI and high-performance computing packaging.

Hsinchu – September 11, 2026 -- Spirox Corporation (TWSE: 3055) has launched the SP7000G, a high-speed crack inspection system for Through Glass Via (TGV) technology, capable of scanning a full 510mm x 515mm glass substrate in under 20 minutes.