Hsinchu – September 11, 2026 -- Spirox Corporation (TWSE: 3055) has launched the SP7000G, a high-speed crack inspection system designed to support high-volume manufacturing of through-glass-via (TGV) substrates for next-generation AI and high-performance computing packaging.
Spirox debuts SP7000G to scan 510mm x 515mm glass substrates in under 20 minutes
The SP7000G performs a full scan of a 510 mm x 515 mm glass substrate in less than 20 minutes, enabling efficient detection of internal microcracks that form after metallization and ABF layer buildup processes. The system is intended to improve inspection efficiency, control process quality, track defect distribution, and optimize yield during mass production.
Corning and DNP executives back Spirox laser tomography scanning for non-destructive defect detection
The announcement came at Spirox's Advanced Packaging Technology Forum, where representatives from Corning and Dai Nippon Printing (DNP) discussed glass core, TGV, reliability and inspection technologies for AI and HPC applications. Corning's Odessa Petzold said Spirox's laser tomography scanning technology offers a non-destructive approach to inspecting glass materials, allowing defect detection in glass structures without damaging the material -- a capability she called valuable for advanced packaging processes like TGV as the industry moves toward high-volume manufacturing.
DNP's Satoru Kuramochi said reliability and failure analysis will grow in importance as glass core technologies move into mass production, driven by rising demand for high-performance, high-density packaging from AI servers. He said non-destructive inspection technologies for glass substrates and TGV are expected to play a central role in identifying defects and understanding issues across manufacturing stages.
Spirox pairs SP7000G with SP8000G platform for R&D and quality-control analysis
Spirox's Paul Yang said the SP7000G, combined with the company's SP8000G platform for R&D and quality-control analysis, gives customers faster, more precise, non-destructive full-panel inspection and analysis capabilities as TGV manufacturing scales toward mass production. Yang said inspection efficiency and quality control have become critical to production as TGV technology advances toward large-scale manufacturing.