By Editor , 13 September 2026
DB HiTek Completes Reliability Qualification for 8-Inch SiC MOSFET Process

Seoul – September 12, 2026 -- DB HiTek has completed reliability qualification for its 1200V silicon carbide (SiC) MOSFET process on 8-inch (200mm) wafers, becoming the first foundry to build a complete process chain for 8-inch SiC MOSFET production at this voltage class. The South Korean pure-play foundry plans to launch mass production in 2027, targeting the electric vehicle, renewable energy and industrial power electronics markets.

By Editor , 13 September 2026
ASE Technology Discloses August 2026 Net Revenue Report

Taipei – September 12, 2026 -- ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) has released its unaudited consolidated net revenues for August 2026, covering its assembly, testing and material (ATM) business segment.

By Editor , 13 September 2026
Alif Launches $49 StartKit Boards for Edge AI Inferencing

Pleasanton, Calif. – September 12, 2026 -- Alif Semiconductor launched a new family of low-cost evaluation boards priced at an MSRP of $49, aimed at lowering the barrier to on-device AI/ML inference for developers.

By Editor , 12 September 2026
Stäubli to Showcase Semiconductor Connectivity Tech at Semicon West

Windsor, Calif. – September 12, 2026 -- Stäubli will present electrical and fluid connectivity solutions for semiconductor tool manufacturers at Semicon West in San Francisco this October, as chipmakers push suppliers to cut equipment qualification times and boost tool uptime.

By Editor , 12 September 2026
TMC Tongxin Micro Unveils Payment, ID Chips at Seamless Africa 2026

Johannesburg – September 11, 2026 -- Tongxin Microelectronics (TMC TONGXIN MICRO) has shipped over 27 billion chips globally and secured the digital identities of more than 1 billion citizens worldwide, the company disclosed at Seamless Africa 2026, held September 8-9.

By Editor , 12 September 2026
BOE Holds First Overseas Partner Conference at IFA Berlin

Berlin – September 11, 2026 -- BOE Technology opened its first overseas Innovation Partner Conference (IPC) in Berlin on September 7, 2026, running alongside the IFA 2026 electronics show, with more than 200 global display and IoT partners invited to attend.

By Editor , 12 September 2026
BOE Holds First Overseas Innovation Conference in Berlin Alongside IFA 2026

Berlin – September 11, 2026 -- BOE Technology Group opened its first international Innovation Partner Conference (IPC) outside China on September 7, 2026, in Berlin, drawing more than 200 partners to coincide with IFA 2026 under the theme "Innovation, Globalization, Collaboration."

By Editor , 12 September 2026
SuperCom Wins First Illinois County GPS Monitoring Contract

New York – September 11, 2026 -- SuperCom (NASDAQ: SPCB) has secured a direct county-level electronic monitoring contract in Illinois, marking the company's first deal in the state and extending its U.S. footprint to 20 new states since mid-2024.

By Editor , 12 September 2026
Spirox Launches SP7000G High-Speed TGV Crack Inspection System

Hsinchu – September 11, 2026 -- Spirox Corporation (TWSE: 3055) unveiled its SP7000G high-speed TGV crack inspection system, a tool designed to support mass production testing of glass substrates for next-generation AI and HPC packaging.