Hsinchu – September 24, 2026 -- M31 Technology and Ambiq have jointly developed a Foundation IP solution on TSMC's N12e process that cuts leakage power by approximately 50% for always-on edge AI and AIoT chips, the companies announced at the TSMC 2026 North America Open Innovation Platform Ecosystem Forum.

Sunnyvale, Calif. – September 23, 2026 -- Synopsys (Nasdaq: SNPS) has certified its EDA flows on TSMC's A14 process node and expanded a multi-die design collaboration covering agentic AI workflows, integrated voltage regulators on CoWoS® packaging, and co-packaged optics support for TSMC's COUPETM technology.

San Jose, Calif. – September 17, 2026 -- GS Microelectronics U.S., Inc. (GSME) has officially joined TSMC's Open Innovation Platform (OIP) Value Chain Alliance (VCA) as a North American member partner, expanding its role in delivering full-lifecycle ASIC services from IP development through advanced packaging and testing.

Rockville, Md. and Seoul, South Korea – September 13, 2026 -- Ceva, Inc. (NASDAQ: CEVA) and LG Electronics have secured a major U.S. semiconductor company as a customer for a jointly developed Ultra-Wideband (UWB) solution, marking commercial validation for the two-company collaboration announced today.