Johannesburg – September 15, 2026 -- Tongxin Microelectronics (TMC TONGXIN MICRO) unveiled its THD89 payment chip series and E450R open-architecture security chip at Seamless Africa 2026, held September 8-9 in Johannesburg, positioning the Chinese semiconductor firm deeper into Africa's digital finance and identity infrastructure market.

Johannesburg – September 11, 2026 -- Tongxin Microelectronics (TMC TONGXIN MICRO) has shipped over 27 billion chips globally and secured the digital identities of more than 1 billion citizens worldwide, the company disclosed at Seamless Africa 2026, held September 8-9.