By Editor , 29 September 2026
Compal Unveils 800VDC AI Factory Infrastructure at OCP Summit

San Jose – September 29, 2026 -- Compal Electronics (TWSE: 2324) will showcase megawatt-scale power and liquid-cooling infrastructure for NVIDIA accelerated computing at OCP Global Summit 2026, positioning rack-level integration as the next bottleneck for AI data centers.

By Editor , 7 September 2026
HUMAIN Taps Compal as ODM Partner for AI Infrastructure Buildout

Riyadh – September 07, 2026 -- HUMAIN, the Saudi Public Investment Fund-backed AI company, has named Compal Electronics (TWSE: 2324) its strategic long-term ODM partner to build next-generation AI infrastructure and intelligent computing platforms.

By Editor , 7 September 2026
HUMAIN Taps Compal as Long-Term ODM Partner for Cloud-to-Edge AI

Riyadh – September 07, 2026 -- HUMAIN has named Compal Electronics (TWSE:2324) as its long-term strategic ODM partner to build AI infrastructure spanning cloud data centers to edge devices, with the deal signed and showcased at LEAP 2026 in Riyadh, Saudi Arabia.