Taipei – September 07, 2026 -- Gemtek Technology Co., Ltd. and Dixon Technologies (India) Limited are deepening their strategic collaboration through an Indian joint venture, expanding production capacity for optical transceivers, bidirectional optical subassemblies (BOSA) and other high-speed optical connectivity solutions.
Gemtek and Dixon combine photonic engineering with large-scale Indian manufacturing
The partnership pairs Gemtek's expertise in optical communications, photonic integration and product development with Dixon's manufacturing scale, supply-chain knowledge and market presence in India. The goal is a scalable platform serving broadband, telecom, data center, AI and cloud infrastructure markets in India and globally.
Product roadmap spans transceivers from 1G to 1.6T speeds
Gemtek is expanding its optical connectivity portfolio to cover data rates from 1G to 1.6T, including optical transceivers, compact pluggable transceivers, BOSA modules and other high-speed connectivity products. By combining electronic integrated circuits with photonic integrated circuits and advanced manufacturing capabilities, Gemtek is advancing toward 800G, 1.6T and next-generation photonic integration technologies to meet rising bandwidth demand driven by AI, data center and cloud infrastructure buildouts.
Collaboration reinforces India's push for local optical component manufacturing
The tie-up supports India's growing effort to localize manufacturing of optical transceivers, BOSA units and other high-speed optical solutions. Pairing Gemtek's technology and product development with Dixon's local manufacturing capacity and supply-chain expertise opens a path to scalable production in India, complementing Gemtek's global manufacturing network and adding geographic diversification to its supply chain.
Gemtek to showcase optical connectivity lineup at India Mobile Congress 2026
Gemtek will exhibit at the India Mobile Congress (IMC) 2026, running October 7-10, 2026 at the Yashobhoomi convention centre in New Delhi, India (Hall 2, Booth B1). The company will present its 1G-to-1.6T optical connectivity range alongside solutions for broadband, telecom and AI data center applications, including optical transceivers, BOSA modules and next-generation high-speed optical connectivity technologies.