Garching, Germany – October 06, 2026 -- SUSS MicroTec SE has launched its first wafer-level cleaning system, the GT200, marking the company's entry into a wafer-cleaning market it values at approximately €5.4 billion, according to research from SUSS and Yole.
SUSS extends photomask expertise into wafer-level cleaning for the first time
The GT200 forms the opening platform of a new GreenTec Solutions product line, combining two established SUSS process technologies, TurbulenStrip and CrustBuster, previously confined to the company's Photomask Solutions segment. TurbulenStrip handles batch soaking and single-wafer resist removal, while CrustBuster applies patented in-situ UV technology to strip organic residues directly at the wafer surface. SUSS says the hybrid approach cuts chemical consumption and eliminates hazardous acids compared with conventional wafer-cleaning methods.
GT200 targets 200mm production for MEMS, RF and power device manufacturers
The system is built for research and development, process qualification, and production environments processing 200mm wafers across MEMS, RF, Power Device and CMOS applications. SUSS is pairing the equipment sale with joint evaluation programs, process co-development and recipe optimization services intended to de-risk technology transfers before customers scale to volume production.
Demand pulls forward 300mm high-volume manufacturing timeline to 2027
SUSS originally planned a staged rollout toward high-volume manufacturing (HVM) platforms, but Yuta Nagai, Senior Vice President Photomask Solutions at SUSS, said strong customer interest has accelerated the schedule for a 300mm HVM system to 2027. A corresponding 200mm HVM platform is set to follow in 2028, giving customers a defined migration path from qualification to full-scale production.
CEO ties launch to Ambition 2030 growth strategy amid AI-driven chip demand
Burkhardt Frick, Chief Executive Officer of SUSS, described the GreenTec launch as a milestone in the company's Ambition 2030 strategy, citing advanced packaging, heterogeneous integration and semiconductor demand tied to AI and high-performance computing as growth drivers for the wafer-cleaning segment. SUSS plans to showcase the GT200 and GreenTec Solutions at SEMICON West through product deep-dive sessions.